Advantages of COB technology:

1. Better performance: COB technology is used to directly bind the chip bare die to the PCB board, eliminating the requirement for wire bonding connection, increasing the connection density of input/output (I/O), and making the product performance more reliable and stable.

2. Higher integration: COB technology is used to eliminate the link pins between the chip and the application circuit board, improving the integration of the product.

3. Smaller volume: COB technology is used, because it can be bound and mounted on both sides of the PCB, the volume of the COB application module is correspondingly reduced, and the application space of the COB module is expanded.

4. Stronger ease of use and simpler product process flow: The latest cluster bus technology is used, and pins are used between the COB board and the application board for convenient interconnection, eliminating the welding process that the chip must go through, reducing the difficulty of product use, simplifying the product process, and making the product easier to replace, enhancing the ease of use of the product.

5. Lower cost: COB technology is to bind and package directly on the PCB board, eliminating the cost of chip planting, welding and other processing processes, and the design of the user board is simpler, only a single-layer board is needed, which effectively reduces the cost of embedded products.